Welcome to the official website of Shanghai Wenliang Changping Electrical Technology Co., Ltd. (Stock Company) / Jiaxing Wenliang Electronic Technology Co., Ltd.

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About Us

Wenliang High-Tech Research and Development Center was established in 2016, focusing on the automotive-grade electronic circuit field. It is dedicated to the research,prototyping, and delivery of electronic circuit boards for automotive lighting modules. The R&D team consists of over 40 members, including 5 professionals with over 20 years of industry expertise and 18 technical personnel with more than 10 years of experience.

The company holds over 80 patents, specializing in automotive electronics. It excels in R&D and technological innovation for high thermal conductivity, 3D assembly, and multi-dimensional circuit connectivity applications, committed to providing tailored solutions for clients.


Leading Special Technologies
serial number Technical Name Specific implementation objectives
1 Double-layer (Through-hole) Circuit Single-sided Welding High Thermal Conductivity Metal Substrate Achieve high wiring density and thermal conductivity in double-layer metal substrate products
2 Blind Hole Grounding Process for Thermal Aluminum Substrate Develop a novel aluminum base bump preparation and aluminum-based metallization process
3 Double-layer Single-sided Aluminum Substrate (FPC Local Buildup) Enable FPC and single-sided aluminum substrate positioning to achieve partial double-layer circuit functionality
4 Anti-tear Design for Multi-material Circuit Composite Flexible Boards Significantly enhance tear resistance of FPC and right-angle PCB composites
5 Ceramic embedded in the FR4 Multi layer andthe structure to avoid the circuit crack Adopt buffer structures to mitigate severe CTE mismatch between ceramic and FR4 substrates
6 High-current IGBT Printed Circuit Board Enable direct soldering of silicon carbide chips to reduce packaging complexity
7 Automotive Flexible Impedance Circuit Board Implement three-layer FPC differential circuit processing technology
8 Multi-material Composite Board (Double-layer HASL PCB + Single-layer ENIG FPC) Replace wiring harnesses for rapid assembly and more reliable circuit connections
9 Automotive ISD Interactive Double-sided FPC (with Aluminum Heat Dissipation & High-density Pads) Achieve efficient connections between high-density wiring light boards and multi-layer control boards
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