Technology driven development | Wenliang Electronics strengthens its core competitiveness in automotive PCB innovation with over 80 patents

Innovative research and development is the core foundation for the sustainable development of Wenliang Electronics. In 2016, the company officially established a high-tech research and development center, which focuses on the research and development, sample trial production, and process optimization of automotive grade electronic circuit products, and has built a mature and experienced professional technical team. The R&D team consists of more than 40 professional technical personnel, including 5 industry senior technical experts with over 20 years of experience and 18 frontline R&D engineers with over 10 years of experience. They have been deeply involved in cutting-edge technologies such as high thermal conductivity substrates, 3D assembly, and multi material composite circuits for many years.

After years of technological breakthroughs, the company has obtained more than 80 authorized patents, covering various core product processes for automotive applications such as thermoelectric separation copper substrates, soft and hard bonded thermally conductive aluminum substrates, ceramic hybrid substrates, aluminum based boss preparation, FPC tear resistant structures, and silicon carbide chip direct soldering circuit boards. Many of these technologies are industry firsts. As early as 2013, the company independently developed the world's first convex point steel plate SCOF product and achieved market implementation; Subsequently, key technologies such as 400W/m · K ultra-high thermal conductivity copper substrate, TG ≥ 170 ℃ ceramic hybrid substrate, and soft hard combination circuit board replacing traditional wiring harnesses will be successively overcome to meet the new generation of intelligent vehicle hardware requirements such as LED headlights, pixel headlights, and LiDAR.

At present, the company has mastered more than ten industry-leading special processes, including blind hole grounded aluminum substrate technology, multi-layer embedded ceramic buffer circuit structure, three-layer FPC differential circuit processing, high current IGBT circuit board manufacturing, etc., which can solve industry pain points such as high heat dissipation, high-density wiring, frequent bending, and high and low temperature tolerance of automotive products. The R&D center synchronizes with the supporting product trial production line, which can quickly complete customer customized scheme sample verification, continuously iterate and optimize processes, and provide lightweight, high heat dissipation, and high reliability PCB customized solutions for vehicle customers, supporting long-term stable development of enterprises through continuous technological innovation.