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Partially bendable structural rigid boards

Common specifications
The thickness of the bendable area:250 μm
Toughened layer thickness:50 μm
The total thickness of the substrate:1600 μm
Number of board circuit layers:4 layers Conductive layer thickness:Inner layer 35 μm; Outer layer 45 μm
Surface treatment:OSP
Fields of application:Car ISD Interactive Lights

category :Type of car headlights

views:34

Date:2026-05-13

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