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Thermoelectric separation of single-layer copper substrates

Common specifications
Thickness of copper plate:1200 μm / 1500 μm
Thickness of insulation:80 μm
Conductive layer thickness:35 μm
Thermal conductivity:Pass-through heat conduction>300 W / m . k
Fields of application:Car high/low beams

category :Type of car headlights

views:44

Date:2026-05-14

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